Display apparatus and method of manufacturing the display apparatus

ABSTRACT

A display apparatus includes a first display area including a first display unit configured to generate light and a first encapsulation unit disposed on the first display unit; a second display area including a second display unit configured to generate light and a second encapsulation unit disposed on the second display unit; and a through area disposed between the first display area and the second display area. The first encapsulation unit includes a first encapsulation layer covering a first side of an area of the first display unit corresponding to the through area. The second encapsulation unit includes a second encapsulation layer covering a second side of an area of the second display unit corresponding to the through area.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.16/136,206, filed Sep. 19, 2018, which is a Continuation of U.S. patentapplication Ser. No. 15/093,091, filed Apr. 7, 2016, now issued as U.S.Pat. No. 10,128,461, which claims priority to and the benefit of KoreanPatent Application No. 10-2015-0113368, filed Aug. 11, 2015, each ofwhich is hereby incorporated by reference for all purposes as if fullyset forth herein.

BACKGROUND Field

One or more exemplary embodiments relate to display technology, and,more particularly, to display devices and methods of manufacturing thedisplay devices.

Discussion of the Background

Use of conventional display devices, such as flat panel display devices,has become diversified with an increasing range of uses due, in part, tothe relatively small thickness and relatively lightweight of the displaydevices. Given that display devices may be formed in a flat shape,various methods may be used to design a shape of the display devices,and functions that may be applied or linked to the display devicesincrease.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

One or more exemplary embodiments include display apparatuses having animproved user convenience and an improved durability and methods ofmanufacturing the display apparatuses.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

According to one or more exemplary embodiments, a display apparatusincludes a first display area including a first display unit configuredto generate light and a first encapsulation unit disposed on the firstdisplay unit; a second display area including a second display unitconfigured to generate light and a second encapsulation unit disposed onthe second display unit; and a through area disposed between the firstdisplay area and the second display area. The first encapsulation unitincludes a first encapsulation layer covering a first side of an area ofthe first display unit corresponding to the through area. The secondencapsulation unit includes a second encapsulation layer covering asecond side of an area of the second display unit corresponding to thethrough area.

According to one or more exemplary embodiments, a method ofmanufacturing a display apparatus includes forming a first display areaincluding a first display unit configured to generate light and a firstencapsulation unit disposed on the first display unit; forming a seconddisplay area including a second display unit configured to generatelight and a second encapsulation unit disposed on the second displayunit; and forming a through area between the first display area and thesecond display area. The first encapsulation unit includes a firstencapsulation layer covering a first side of an area of the firstdisplay unit corresponding to the through area. The second encapsulationunit includes a second encapsulation layer covering a second side of anarea of the second display unit corresponding to the through area.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

FIG. 2A is a partial plan view of the display apparatus of FIG. 1 asviewed in a direction K, according to one or more exemplary embodiments.

FIGS. 2B, 2C, 2D, and 2E are plan views of modified display apparatuses,according to one or more exemplary embodiments.

FIG. 3 is an enlarged schematic cross-sectional view of region S of thedisplay apparatus of FIG. 1, according to one or more exemplaryembodiments.

FIG. 4 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

FIG. 5 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

FIG. 6 is an enlarged cross-sectional view of region S of the displayapparatus of FIG. 5, according to one or more exemplary embodiments.

FIG. 7 is an enlarged cross-sectional view of region W of the displayapparatus of FIG. 5, according to one or more exemplary embodiments.

FIG. 8 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

FIG. 9 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

FIG. 10 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

FIG. 11 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

FIG. 12 is a partial plan view of the display apparatus of FIG. 11 asviewed in a direction K, according to one or more exemplary embodiments.

FIGS. 13A, 13B, 13C, 13D, 13E, and 13F are cross-sectional views of adisplay apparatus at various stages of manufacture, according to one ormore exemplary embodiments.

FIGS. 14A, 14B, 14C, 14D, 14E, 14F, 14G, and 14H are cross-sectionalviews of a display apparatus at various stages of manufacture, accordingto one or more exemplary embodiments.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail ofvarious exemplary embodiments. Therefore, unless otherwise specified,the features, components, modules, layers, films, panels, regions,and/or aspects of the various illustrations may be otherwise combined,separated, interchanged, and/or rearranged without departing from thedisclosed exemplary embodiments. Further, in the accompanying figures,the size and relative sizes of layers, films, panels, regions, etc., maybe exaggerated for clarity and descriptive purposes. When an exemplaryembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. Further, the x-axis, the y-axis, and thez-axis are not limited to three axes of a rectangular coordinate system,and may be interpreted in a broader sense. For example, the x-axis, they-axis, and the z-axis may be perpendicular to one another, or mayrepresent different directions that are not perpendicular to oneanother. For the purposes of this disclosure, “at least one of X, Y, andZ” and “at least one selected from the group consisting of X, Y, and Z”may be construed as X only, Y only, Z only, or any combination of two ormore of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. Likenumbers refer to like elements throughout. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, components, regions, layers, and/or sections,these elements, components, regions, layers, and/or sections should notbe limited by these terms. These terms are used to distinguish oneelement, component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments. FIG. 3 is an enlargedcross-sectional view of region S of the display apparatus of FIG. 1.

Referring to FIGS. 1 and 3, the display apparatus 100 may include afirst display area DA1, a second display area DA2, and a through areaTA. The through area TA may be disposed between the first display areaDA1 and the second display area DA2. In some exemplary embodiments, thedisplay apparatus 100 may include a substrate 101 on which the firstdisplay area DA1 and the second display area DA2 may be disposed. Thesubstrate 101 may enable relatively easy formation of the first displayarea DA1 and the second display area DA2, as well as improve thedurability of the display apparatus 100. The substrate 101 may includeany suitable materials, such as, for example, a glass material, a metalmaterial, or other organic materials. In some exemplary embodiments, thesubstrate 101 may include a flexible material. For example, thesubstrate 101 may be intentionally bent, curved, folded, rolled, and/orthe like. It is also contemplated that the substrate 101 may includeultra-thin glass, metal, or plastic. For instance, when the substrate101 is formed using plastic, polyimide (PI) may be utilized, however,any other suitable material may be utilized in association withexemplary embodiments described herein.

The through area TA may have a shape corresponding to the wholethickness of the substrate 101. That is, the through area TA may extendthrough the thickness of the substrate 101. Although not shown, in someexemplary embodiments, the through area TA may be formed to correspondto a part of the thickness of the substrate 101. In this manner, thethickness of an area of the substrate 101 corresponding to the througharea TA may be smaller than the thickness of another area of thesubstrate 101. The first display area DA1 and the second display areaDA2 will be described in more detail below.

The first display area DA1 may include a first display unit DU1 and afirst encapsulation unit EU1. The first display area DA1 may be formedon the substrate 101 and may be configured to generate light. A user mayrecognize the light generated by the first display unit DU1. To thisend, the first display unit DU1 may include one or more display devices.For example, as shown in FIG. 3, the first display unit DU1 may includean organic light-emitting device 110. The organic light-emitting device110 may include a first electrode 111, a second electrode 112, and anintermediate layer 113.

The first electrode 111 may include any suitable conductive material. Insome exemplary embodiments, the first electrode 111 may be patterned,and, when the first display area DA1 includes a plurality of pixels (notshown), the first electrode 111 may be patterned to correspond to thepixels, respectively. In some exemplary embodiments, the first electrode111 may include at least one material selected from the group consistingof transparent conductive oxides including indium tin oxide (ITO),indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indiumgallium oxide (IGO), aluminum zinc oxide (AZO), and gallium zinc oxide(GZO). It is also contemplated that one or more conductive polymers(ICP) may be utilized, such as, for example, polyaniline (PANI),poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS),etc. The first electrode 111 may include a metal with a relatively highreflectance, such as silver (Ag), however, any other suitable metal maybe utilized in association with exemplary embodiments described herein.

The intermediate layer 113 may include an organic emission layerincluding a relatively small molecular organic material or a polymermolecular organic material. In some exemplary embodiments, theintermediate layer 113 may include the organic emission layer and mayfurther include at least one layer selected from the group consisting ofa hole injection layer (HIL), a hole transport layer (HTL), an electrontransport layer (ETL), and an electron injection layer (EIL). The secondelectrode 112 may include any suitable conductive material, such as, forexample, lithium (Li), calcium (Ca), lithium fluoride (LiF), aluminum(Al), magnesium (Mg), silver (Ag), etc. The second electrode 112 mayinclude a single layer or multiple layers including at least one of theconductive materials, and may include an alloy including at least two ofthe conductive materials.

The first encapsulation unit EU1 may be formed on the first display unitDU1 and may have a extending shape to correspond to the through area TA.That is, the first encapsulation unit EU1 may be formed to at leastpartially cover a side of the area of the first display unit DU1neighboring the through area TA. In some exemplary embodiments, thefirst encapsulation unit EU1 may be formed to completely cover the sideof the area of the first display unit DU1 neighboring the through areaTA. In some exemplary embodiments, the first encapsulation unit EU1 mayinclude any suitable insulating material. For example, the firstencapsulation unit EU1 may include an inorganic material. In someexemplary embodiments, the first encapsulation unit EU1 may include anoxide or nitride material. For instance, the first encapsulation unitEU1 may include silicon nitride (SiN_(x)), silicon oxide (SiO_(x)), orsilicon oxynitride (SiO_(x)N_(y)).

According to one or more exemplary embodiments, the first encapsulationunit EU1 may include an organic material. In some exemplary embodiments,the first encapsulation unit EU1 may include a metal material. Further,the first encapsulation unit EU1 may extend to a top surface of thesubstrate 101. In some exemplary embodiments, the first encapsulationunit EU1 may be spaced apart from a side of the area of the substrate101 corresponding to the through area TA.

The second display area DA2 may include a second display unit DU2 and asecond encapsulation unit EU2. The second display unit DU2 may be formedon the substrate 101 and may be configured to generate light. A user mayrecognize the light generated by the second display unit DU2. To thisend, the second display unit DU2 may include one or more displaydevices. For example, like the first display unit DU1 described withreference to FIG. 3, the second display unit DU2 may also include anorganic light-emitting device. The organic light-emitting device may bethe same as the organic light-emitting device 110 of the first displayunit DU1 described above, and, as such, a detailed description thereofis omitted.

The second encapsulation unit EU2 may be formed on the second displayunit DU2 and may have an extending shape to correspond to the througharea TA. That is, the second encapsulation unit EU2 may at leastpartially cover a side of the area of the second display unit DU2neighboring the through area TA. In some exemplary embodiments, thesecond encapsulation unit EU2 may completely cover the side of the areaof the second display unit DU2 neighboring the through area TA. In someexemplary embodiments, the second encapsulation unit EU2 may include anysuitable insulating material. For instance, the second encapsulationunit EU2 may include an inorganic material. In some exemplaryembodiments, the second encapsulation unit EU2 may include an oxide ornitride material. For example, the second encapsulation unit EU2 mayinclude silicon nitride (SiN_(x)), silicon oxide (SiO_(x)), or siliconoxynitride (SiO_(x)N_(y)).

According to one or more exemplary embodiments, the second encapsulationunit EU2 may include an organic material. In some exemplary embodiments,the second encapsulation unit EU2 may include a metal material. In someexemplary embodiments, the second encapsulation unit EU2 may extend tothe top surface of the substrate 101. In some exemplary embodiments, thesecond encapsulation unit EU2 may be spaced apart from a side of thearea of the substrate 101 corresponding to the through area TA.

FIG. 2A is a partial plan view of the display apparatus of FIG. 1 asviewed in a direction K, according to one or more exemplary embodiments.FIGS. 2B, 2C, 2D, and 2E are plan views of modified display apparatuses,according to one or more exemplary embodiments.

Referring to FIG. 2A, the through area TA may be formed between thefirst display area DA1 and the second display area DA2. Although notshown in detail in FIG. 2A, the first display area DA1 and the seconddisplay area DA2 may be completely spaced apart from each other. In someexemplary embodiments, the through area TA may extend to at least oneedge of the display apparatus 100.

In a modified example, referring to FIG. 2B, the first display area DA1and the second display area DA2 may be spaced apart from each other bythe through area TA and may be connected to each other in an area otherthan the through area TA. In another modified example, referring to FIG.2C, the through area TA may be surrounded by the first display area DA1and the second display area DA2. To this end, the first display area DA1and the second display area DA2 may be connected to each other. Aboundary line of the through area TA may include a curve, and, in someexemplary embodiments, may be a circular arc or a circle. In anothermodified example, referring to FIG. 2D, an area of the edge of thedisplay apparatus 100 may include a curve, and, in some exemplaryembodiments, may include a circular arc. In another example, the edge ofthe display apparatus 100 may be a circle.

In another modified example, referring to FIG. 2E, the display apparatus100 may include two through areas TA1 and TA2, for example, the firstthrough area TA1 and the second through area TA2. The first through areaTA1 may be between the first display area DA1 and the second displayarea DA2. The second through area TA2 may be between the second displayarea DA2 and a third display area DA3. Although not illustrated indetail, the third display area DA3 may include the same elements as thefirst display area DA1 or the second display area DA2, e.g., a thirddisplay unit and a third encapsulation unit. The second through area TA2may be similar to the first through area TA1. Shapes of the seconddisplay area DA2 and the third display area DA3 in an area neighboringthe second through area TA2 may be the same as the first display areaDA1 and the second display area DA2 in an area neighboring the firstthrough area TA1.

Although not shown, the display apparatus 100 may include three or morethrough areas TA. The shapes of FIGS. 2A through 2E may be applied tonot only the display apparatus 100 of FIG. 1, but also to displayapparatuses 200, 300, 400, 500, 600, and 700 that will be describedbelow in association with FIGS. 4, 5, 8, 9, 10, 11, and 12. In theexemplary embodiments and the modified examples described above, and theexemplary embodiments and the modified examples that will be describedbelow, the first display area DA1 and the second display area DA2 mayinclude different materials and/or the same material.

When the first display area DA1 and the second display area DA2 includethe same material, in some exemplary embodiments, the first display areaDA1 and the second display area DA2 may be simultaneously formed. Thatis, the first display unit DU1 and the second display unit DU2 mayinclude the same material, and the first encapsulation unit EU1 and thesecond encapsulation unit EU2 may include the same material. When thefirst display unit DU1 and the second display unit DU2 include the samematerial, in some exemplary embodiments, the first display unit DU1 andthe second display unit DU2 may be simultaneously formed. When the firstencapsulation unit EU1 and the second encapsulation unit EU2 include thesame material, the first encapsulation unit EU1 and the secondencapsulation unit EU2 may be simultaneously formed.

The display apparatus 100 may include the first display area DA1, thesecond display area DA2, and the through area TA between the firstdisplay area DA1 and the second display area DA2. The display apparatus100 may be capable of adding various functions via the through area TA.For instance, the through area TA may be a space for a separate member(or component) for a function of the display apparatus 100 or a separatemember for adding a new function to the display apparatus 100, therebyimproving user convenience.

According to one or more exemplary embodiments, the first display areaDA1 may include the first display unit DU1 and the first encapsulationunit EU1, and the first encapsulation unit EU1 may extend to cover onearea of the side of at least the first display unit DU1 corresponding tothe through area TA. In this manner, the first encapsulation unit EU1may effectively protect the first display unit DU1, and, in particular,protect the first display unit DU1 from external shock, impurities, air,moisture, debris, etc., in the area of the first display unit DU1corresponding to the through area TA. When the first encapsulation unitEU1 selectively covers the whole area of the side of the first displayarea DA1 corresponding to the through area TA, an effect of protectingthe first display unit DU1 may increase.

The second display area DA2 may include the second display unit DU2 andthe second encapsulation unit EU2, and the second encapsulation unit EU2may extend to cover one area of the side of at least the second displayunit DU2 corresponding to the through area TA. In this manner, thesecond encapsulation unit EU2 may effectively protect the second displayunit DU2, and, in particular, protect the second display unit DU2 fromexternal shock, impurities, air, moisture, debris, etc., in the area ofthe second display unit DU2 corresponding to the through area TA. Whenthe second encapsulation unit EU2 selectively covers the whole area ofthe side of the second display area DA2 corresponding to the througharea TA, an effect of protecting the second display unit DU2 mayincrease.

FIG. 4 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

Referring to FIG. 4, the display apparatus 200 may include the firstdisplay area DA1, the second display area DA2, and the through area TA.The through area TA may be disposed between the first display area DA1and the second display area DA2. In some exemplary embodiments, thedisplay apparatus 200 may include a substrate 201 on which the firstdisplay area DA1 and the second display area DA2 may be formed. In thismanner, the substrate 201 may enable relatively easy formation of thefirst display area DA1 and the second display area DA2, as well asimprove the durability of the display apparatus 100. The substrate 201may include any suitable material, such as the materials described inassociation with substrate 101.

The through area TA may have a shape corresponding to the wholethickness of the substrate 201. That is, the through area TA may extendthrough the thickness of the substrate 201. Although not shown, in someexemplary embodiments, the through area TA may be formed to correspondto only a part of the thickness of the substrate 201. In this manner,the thickness of an area of the substrate 201 corresponding to thethrough area TA may be smaller than the thickness of another area of thesubstrate 201. The first display area DA1 and the second display areaDA2 will now be described in more detail below.

The first display area DA1 may include the first display unit DU1 andthe first encapsulation unit EU1. The first display area DA1 may beformed on the substrate 201 and may be configured to generate light. Auser may recognize the light generated by the first display unit DU1. Tothis end, the first display unit DU1 may include one or more displaydevices. For example, the first display unit DU1 may include an organiclight-emitting device. The organic light-emitting device may beconfigured as described in association with the organic light-emittingdevice of the display apparatus 100 of FIG. 1, and, as such, a detaileddescription thereof is omitted.

The first encapsulation unit EU1 may include a first encapsulation layer251, a second encapsulation layer 252, and an intermediate encapsulationlayer 261. Although not shown, in some exemplary embodiments, the firstencapsulation layer 251 may include various numbers of encapsulationlayers. This may apply to the second encapsulation unit EU2 that will bedescribed below. The first encapsulation layer 251 may be formed on thefirst display unit DU1 and may have an extending shape to correspond tothe through area TA. That is, the first encapsulation layer 251 may beformed to at least partially cover a side of the area of the firstdisplay unit DU1 neighboring the through area TA.

In some exemplary embodiments, the first encapsulation layer 251 may beformed to completely cover the side of the area of the first displayunit DU1 neighboring the through area TA. In some exemplary embodiments,the first encapsulation layer 251 may include any suitable insulatingmaterial. In some exemplary embodiments, the first encapsulation layer251 may include an inorganic material. In some exemplary embodiments,the first encapsulation layer 251 may include an oxide or nitridematerial. For example, the first encapsulation layer 251 may includesilicon nitride (SiN_(x)), silicon oxide (SiO_(x)), or siliconoxynitride (SiO_(x)N_(y)). In some exemplary embodiments, the firstencapsulation layer 251 may include an organic material. In someexemplary embodiments, the first encapsulation layer 251 may extend to atop surface of the substrate 201. In some exemplary embodiments, thefirst encapsulation layer 251 may be spaced apart from a side of thearea of the substrate 201 corresponding to the through area TA.

The intermediate encapsulation layer 261 may at least overlap with thefirst display unit DU1 and may be formed on the first encapsulationlayer 251. In some exemplary embodiments, a top surface of theintermediate encapsulation layer 261 may include a planar surface. Insome exemplary embodiments, an edge of the area of the intermediateencapsulation layer 261 neighboring the through area TA may not be overan edge of the first encapsulation layer 251 neighboring the througharea TA. In some exemplary embodiments, the intermediate encapsulationlayer 261 may include an inorganic material.

The second encapsulation layer 252 may be formed on the intermediateencapsulation layer 261 and the first display unit DU1. The secondencapsulation layer 252 may have an extending shape to correspond to thethrough area TA. That is, the second encapsulation layer 252 may beformed to at least partially cover the side of the area of the firstdisplay unit DU1 neighboring the through area TA. In some exemplaryembodiments, the second encapsulation layer 252 may be formed tocompletely cover the side of the area of the first display unit DU1neighboring the through area TA. In some exemplary embodiments, thesecond encapsulation layer 252 may contact the first encapsulation layer251 in an area disposed adjacent to at least the through area TA. Insome exemplary embodiments, the second encapsulation layer 252 may coverthe first encapsulation layer 251, and the first encapsulation layer 251may not be exposed by the second encapsulation layer 252 in the througharea TA. In some exemplary embodiments, the second encapsulation layer252 may include any suitable insulating materials. In some exemplaryembodiments, the second encapsulation layer 252 may include an inorganicmaterial. In some exemplary embodiments, the second encapsulation layer252 may include an oxide or nitride material. For example, the secondencapsulation layer 252 may include silicon nitride (SiN_(x)), siliconoxide (SiO_(x)), or silicon oxynitride (SiO_(x)N_(y)). In some exemplaryembodiments, the second encapsulation layer 252 may include an organicmaterial.

In some exemplary embodiments, the second encapsulation layer 252 mayextend to the top surface of the substrate 201. In some exemplaryembodiments, at least one of the first encapsulation layer 251, thesecond encapsulation layer 252, and the intermediate encapsulation layer261 may include a metal material. In some exemplary embodiments, thesecond encapsulation layer 252 may be spaced apart from a side of thearea of the substrate 201 corresponding to the through area TA. In someexemplary embodiments, the second encapsulation layer 252 may includethe same material as that of the first encapsulation layer 251, and, assuch, the first encapsulation layer 251 and the second encapsulationlayer 252 may easily contact one another in an area neighboring thethrough area TA. In this manner, the first encapsulation layer 251 andthe second encapsulation layer 252 may easily reduce or block moisture,impurities, external air, debris, etc., from the first display unit DU1in the through area TA. In some exemplary embodiments, the intermediateencapsulation layer 261 may be surrounded by the first encapsulationlayer 251 and the second encapsulation layer 252.

The second display area DA2 may include the second display unit DU2 andthe second encapsulation unit EU2. The second display unit DU2 may beformed on the substrate 201 and may be configured to generate light. Auser may recognize the light generated by the second display unit DU2.To this end, the second display unit DU2 may include one or more displaydevices. For example, the second display unit DU2 may include an organiclight-emitting device. The organic light-emitting device may beconfigured similarly to the organic light-emitting device of the displayapparatus 100, and, therefore, a detailed description thereof isomitted.

The second encapsulation unit EU2 may include a first encapsulationlayer 271, a second encapsulation layer 272, and an intermediateencapsulation layer 281. The first encapsulation layer 271 may be formedon the second display unit DU2 and may have an extending shape tocorrespond to the through area TA. That is, the first encapsulationlayer 271 may be formed to at least partially cover a side of the areaof the second display unit DU2 neighboring the through area TA. In someexemplary embodiments, the first encapsulation layer 271 may be formedto completely cover the side of the area of the second display unit DU2neighboring the through area TA. In some exemplary embodiments, thefirst encapsulation layer 271 may include any suitable insulatingmaterial. In some exemplary embodiments, the first encapsulation layer271 may include an inorganic material. In some exemplary embodiments,the first encapsulation layer 271 may include an oxide or nitridematerial. For example, the first encapsulation layer 271 may includesilicon nitride (SiN_(x)), silicon oxide (SiO_(x)), or siliconoxynitride (SiO_(x)N_(y)). In some exemplary embodiments, the firstencapsulation layer 271 may include an organic material.

According to one or more exemplary embodiments, the first encapsulationlayer 271 may extend to a top surface of the substrate 201. In someexemplary embodiments, the first encapsulation layer 271 may be spacedapart from a side of the area of the substrate 201 corresponding to thethrough area TA.

The intermediate encapsulation layer 281 may at least overlap with thesecond display unit DU2 and may be formed on the first encapsulationlayer 271. In some exemplary embodiments, a top surface of theintermediate encapsulation layer 281 may include a planar surface. Insome exemplary embodiments, an edge of the area of the intermediateencapsulation layer 281 neighboring the through area TA may not bedisposed over an edge of the first encapsulation layer 271 neighboringthe through area TA. In some exemplary embodiments, the intermediateencapsulation layer 281 may include any suitable material. For instance,the intermediate encapsulation layer 281 may include an organicmaterial. When the intermediate encapsulation layer 281 includes anorganic material, the top surface of the intermediate encapsulationlayer 281 may be easily formed as a planar surface. In some exemplaryembodiments, the intermediate encapsulation layer 281 may include aninorganic material.

The second encapsulation layer 272 may be formed on the intermediateencapsulation layer 281 and the second display unit DU2. The secondencapsulation layer 272 may have an extending shape to correspond to thethrough area TA. That is, the second encapsulation layer 272 may beformed to at least partially cover the side of the area of the seconddisplay unit DU2 neighboring the through area TA. In some exemplaryembodiments, the second encapsulation layer 272 may be formed tocompletely cover the side of the area of the second display unit DU2neighboring the through area TA. In some exemplary embodiments, thesecond encapsulation layer 272 may contact the first encapsulation layer271 in an area at least corresponding to the through area TA.

In some exemplary embodiments, the second encapsulation layer 272 maycover the first encapsulation layer 271, and the first encapsulationlayer 271 may not be exposed by the second encapsulation layer 272 inthe through area TA. In some exemplary embodiments, the secondencapsulation layer 272 may include any suitable insulating material. Insome exemplary embodiments, the second encapsulation layer 272 mayinclude an inorganic material. In some exemplary embodiments, the secondencapsulation layer 272 may include an oxide or nitride material. Forexample, the second encapsulation layer 272 may include silicon nitride(SiN_(x)), silicon oxide (SiO_(x)), or silicon oxynitride(SiO_(x)N_(y)). In some exemplary embodiments, the second encapsulationlayer 272 may include an organic material.

According to one or more exemplary embodiments, at least one of thefirst encapsulation layer 271, the second encapsulation layer 272, andthe intermediate encapsulation layer 281 may include a metal material.In some exemplary embodiments, the second encapsulation layer 272 mayextend to the top surface of the substrate 201. In some exemplaryembodiments, the second encapsulation layer 272 may be spaced apart fromthe side of the area of the substrate 201 corresponding to the througharea TA. In some exemplary embodiments, the second encapsulation layer272 may include the same material as that of the first encapsulationlayer 271, and, as such, the first encapsulation layer 271 and thesecond encapsulation layer 272 may easily contact in an area neighboringthe through area TA. In this manner, the first encapsulation layer 271and the second encapsulation layer 272 may easily reduce or blockmoisture, impurities, external air, debris, etc., from the seconddisplay unit DU2 in the through area TA.

In some exemplary embodiments, the intermediate encapsulation layer 281may be surrounded by the first encapsulation layer 271 and the secondencapsulation layer 272. As described above, the first encapsulationunit EU1 and the second encapsulation unit EU2 may include the samematerial as one another, and may be simultaneously formed. That is, thefirst encapsulation layer 251 of the first display area DA1 and thefirst encapsulation layer 271 of the second display area DA2 may includethe same material as one another, and may be selectively simultaneouslyformed with one another. The intermediate encapsulation layer 261 of thefirst display area DA1 and the intermediate encapsulation layer 281 ofthe second display area DA2 may include the same material as oneanother, and may be selectively simultaneously formed.

According to one or more exemplary embodiments, the display apparatus200 may include the first display area DA1, the second display area DA2,and the through area TA disposed between the first display area DA1 andthe second display area DA2. The display apparatus 200 may be capable ofadding various functions via the through area TA. That is, the througharea TA may be a space for a separate member (or component) for afunction of the display apparatus 200 or a separate member for adding anew function to the display apparatus 200. In this manner, the througharea TA may enable improved user convenience.

According to one or more exemplary embodiments, the first display areaDA1 may include the first display unit DU1 and the first encapsulationunit EU1, and the first encapsulation layer 251 or the secondencapsulation layer 252 of the first encapsulation unit EU1 may extendto cover one area of the side of at least the first display unit DU1corresponding to the through area TA. In this manner, the firstencapsulation unit EU1 may effectively protect the first display unitDU1, and, in particular, protect the first display unit DU1 fromexternal shock, impurities, air, moisture, debris, etc., in the area ofthe first display unit DU1 corresponding to the through area TA. Whenthe first encapsulation layer 251 or the second encapsulation layer 252covers the whole area of the side of the first display area DA1corresponding to the through area TA, an effect of protecting the firstdisplay unit DU1 may increase.

The intermediate encapsulation layer 261 may be formed between the firstencapsulation layer 251 and the second encapsulation layer 252, and,may, thereby improve an encapsulation characteristic of the firstencapsulation unit EU1 with respect to the first display unit DU1. Whena top surface of the intermediate encapsulation layer 261 selectivelyincludes a planar surface, the second encapsulation layer 252 may beplanar, and a top surface of the display apparatus 200 may be easilymanufactured to be planar too.

According to one or more exemplary embodiments, the second display areaDA2 may include the second display unit DU2 and the second encapsulationunit EU2, and the first encapsulation layer 271 and/or the secondencapsulation layer 272 of the second encapsulation unit EU2 may extendto cover one area of the side of at least the second display unit DU2corresponding to the through area TA. In this manner, the secondencapsulation unit EU2 may effectively protect the second display unitDU2, and, in particular, may protect the second display unit DU2 fromexternal shock, impurities, air, moisture, debris, etc., in the area ofthe second display unit DU2 corresponding to the through area TA. Whenthe first encapsulation layer 271 or the second encapsulation layer 272selectively covers the area of the side of the second display area DA2corresponding to the through area TA, an effect of protecting the seconddisplay unit DU2 may be increased.

The intermediate encapsulation layer 281 may be formed between the firstencapsulation layer 271 and the second encapsulation layer 272, and,may, thereby improve an encapsulation characteristic of the secondencapsulation unit EU2 with respect to the second display unit DU2. Whena top surface of the intermediate encapsulation layer 281 selectivelyincludes a planar surface, the second encapsulation layer 272 may beplanar, and the top surface of the display apparatus 200 may be easilymanufactured to include a planar surface too.

FIG. 5 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments. FIG. 6 is an enlargedcross-sectional view of region S of the display apparatus of FIG. 5,according to one or more exemplary embodiments. FIG. 7 is an enlargedcross-sectional view of region W of the display apparatus of FIG. 5,according to one or more exemplary embodiments.

Referring to FIGS. 5 through 7, the display apparatus 300 may includethe first display area DA1, the second display area DA2, and the througharea TA. The through area TA may be disposed between the first displayarea DA1 and the second display area DA2. The first display area DA1 mayinclude a first lower structure LU1, and the second display area DA2 mayinclude a second lower structure LU2.

A part DU1′ of a first display unit DU1 may be formed on the first lowerstructure LU1. For example, the part DU1′ of the first display unit DU1may include at least an intermediate layer 313 and a second electrode312 of the first display unit DU1. In some exemplary embodiments, thefirst lower structure LU1 may include a first electrode 311 of the firstdisplay unit DU1. In some exemplary embodiments, the first lowerstructure LU1 may include one or more thin film transistors and one ormore insulating layers that are disposed on the first electrode 311,which will be described in more detail below.

A part DU2′ of a second display unit DU2 may be formed on the secondlower structure LU2. For example, the part DU2′ of the second displayunit DU2 may include at least the intermediate layer 313 and the secondelectrode 312 of the second display unit DU2. In some exemplaryembodiments, the second lower structure LU2 may include a firstelectrode (not shown) of the second display unit DU2. In some exemplaryembodiments, the second lower structure LU2 may include one or more thinfilm transistors (not shown) and one or more insulating layers (notshown) that are disposed on the first electrode. The configuration ofthe second display unit DU2 may be substantially similar to theconfiguration of the first display unit DU1, and, as such, a descriptionof the second lower structure LU2 is omitted, but may be substantiallysimilar to the description of the first lower structure LU1.

In some exemplary embodiments, the display apparatus 300 may include asubstrate 301 on which the first display area DA1 and the second displayarea DA2 are formed. In this manner, the substrate 301 may enable thefirst display area DA1 and the second display area DA2 to be easilyformed, and may improve the durability of the display apparatus 300.

As seen in FIG. 5, the first lower structure LU1 and the second lowerstructure LU2 may be formed on the substrate 301. The substrate 301 mayinclude any suitable material, such as those materials described inassociation with substrate 101. The first lower structure LU1 will bedescribed in more detail with reference to FIG. 6. The second lowerstructure LU2 may be substantially the same as the first lower structureLU1, and, as such, a detailed description of the second lower structureLU2 is omitted.

Referring to FIG. 6, the first lower structure LU1 may include the firstelectrode 311 and a thin film transistor connected to the firstelectrode 311. The thin film transistor may have various functions, and,for example, may transmit an electrical signal to the first display unitDU1. The thin film transistor may include an active layer 303, a gateelectrode 305, a source electrode 307, and a drain electrode 308. Asseen in FIG. 6, the gate electrode 305 is a top gate-type electrodeformed on the active layer 303. It is contemplated, however, that thefirst lower structure LU1 may include a bottom gate-type electrode.

The active layer 303 may be formed on the substrate 301. In someexemplary embodiments, a buffer layer 302 may be formed between thesubstrate 301 and the active layer 303. The buffer layer 302 may reduceor block penetration of impurities, moisture, external air, etc., into alower portion of the substrate 301, and may provide a planar surface ona top surface of the substrate 301. The buffer layer 302 may include anysuitable insulating material, such as, for example, an inorganicmaterial, e.g., an oxide or nitride material. For instance, the bufferlayer 302 may include silicon oxide (SiO_(x)), silicon nitride(SiN_(x)), silicon oxynitride (SiON), aluminum oxide (Al₂O₃), titaniumoxide (TiO₂), tantalum oxide (Ta₂O₅), hafnium oxide (HfO₂), zinc oxide(ZnO₂), etc.

The active layer 303 may be formed on the buffer layer 302. The activelayer 303 may include any suitable semiconductor material, such as, forexample, amorphous silicon, polycrystalline silicon, etc. It iscontemplated, however, that exemplary embodiments are not limitedthereto, and the active layer 303 may include any suitable material. Insome exemplary embodiments, the active layer 303 may include an organicsemiconductor material. In some exemplary embodiments, the active layer303 may include an oxide semiconductor material.

The gate insulating layer 304 may be formed on the active layer 303. Thegate insulating layer 304 may include any suitable insulating material,and, in some exemplary embodiments, may include an inorganic material.For example, the gate insulating layer 304 may include an oxide ornitride material. For instance, the gate insulating layer 304 mayinclude silicon oxide (SiO_(x)), silicon nitride (SiN_(x)), siliconoxynitride (SiON), aluminum oxide (Al₂O₃), titanium oxide (TiO₂),tantalum oxide (Ta₂O₅), hafnium oxide (HfO₂), zinc oxide (ZnO₂), etc.The gate insulating layer 304 may insulate the active layer 303 and thegate electrode 305 from each other. The gate electrode 305 may beprovided on the gate insulating layer 304. The gate electrode 305 mayinclude a low resistance metal material. For example, the gate electrode305 may include a conductive material including molybdenum (Mo),aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as amultilayer or a single layer.

An interlayer insulating layer 306 may be formed on the gate electrode305. The interlayer insulating layer 306 may insulate the sourceelectrode 307 and the drain electrode 308 from the gate electrode 305.

The interlayer insulating layer 306 may include any suitable insulatingmaterial, and, in some exemplary embodiments, may include an inorganicmaterial. For example, the interlayer insulating layer 306 may includean oxide or nitride material. For instance, the interlayer insulatinglayer 306 may include silicon oxide (SiO_(x)), silicon nitride(SiN_(x)), silicon oxynitride (SiON), aluminum oxide (Al₂O₃), titaniumoxide (TiO₂), tantalum oxide (Ta₂O₅), hafnium oxide (HfO₂), zinc oxide(ZnO₂), etc. The source electrode 307 and the drain electrode 308 may beformed on the interlayer insulating layer 306. The source electrode 307and the drain electrode 308 may be formed as a single layer or amultilayer using a highly conductive material. The source electrode 307and the drain electrode 308 may contact the active layer 303.

A passivation layer 309 may be formed on the source electrode 307 andthe drain electrode 308. The passivation layer 309 may remove a stepcaused by the thin film transistor, and may provide a planar surface ona top surface of the thin film transistor. The passivation layer 309 mayprotect the source electrode 307 and the drain electrode 308. Thepassivation layer 309 may include any suitable material. In someexemplary embodiments, the passivation layer 309 may include an organicmaterial and may be formed as single layer or multiple layers.

In some exemplary embodiments, the passivation layer 309 may includepolymer derivatives having commercial polymers, such as polymethylmethacrylate (PMMA) or polystylene (PS), and a phenol group, anacryl-based polymer, an imide-based polymer, an arylene ether-basedpolymer, an amide-based polymer, a fluorine-based polymer, ap-xylene-based polymer, a vinyl alcohol-based polymer, etc., or acombination thereof. The passivation layer 309 may be formed as a stackincluding an inorganic insulating layer and an organic insulating layer.

The first display unit DU1 may be formed on the passivation layer 309.The first display unit DU1 may be electrically connected to the thinfilm transistor. The first display unit DU1 may include the firstelectrode 311, the second electrode 312, and the intermediate layer 313disposed between the first electrode 311 and the second electrode 312.That is, the first display unit DU1 may be an organic light-emittingdevice. The first electrode 311 may be electrically connected to one ofthe source electrode 307 and the drain electrode 308. As shown in FIG.6, the first electrode 311 is electrically connected to the drainelectrode 308. The first electrode 311 may have various forms. Forexample, the first electrode 311 may include an island-shaped pattern.

A pixel-defining layer 315 may be formed on the passivation layer 309.The pixel-defining layer 315 may be formed to not cover a predeterminedarea of the first electrode 311. The intermediate layer 313 may beformed on the area of the first electrode 311 that is not covered by thepixel-defining layer 315. The second electrode 312 may be formed on theintermediate layer 313. The pixel-defining layer 315 may include one ormore organic insulating materials selected from the group consisting ofpolyimide, polyamide, an acryl resin, benzocyclobutene, and a phenolresin by using a spin coating method.

Although not illustrated, on the second electrode 312, in some exemplaryembodiments, a functional layer (not shown) may be formed thereon. Thefunctional layer may include a plurality of layers formed on the secondelectrode 312. At least one layer of the functional layer may preventcontamination of the second electrode 312 in a subsequent process, andanother layer of the functional layer may improve the efficiency of avisible ray that is discharged from the intermediate layer 313 to thesecond electrode 312. That is, for example, the functional layer mayinclude a capping layer. The capping layer may protect the secondelectrode 312 and may be formed to control a refractive index of thevisible ray implemented by the first display unit DU1 to improve lightefficiency.

According to one or more exemplary embodiments, the functional layer mayinclude a cover layer on the capping layer. The cover layer may include,for example, lithium fluoride (LiF), may protect the second electrode312, may improve light efficiency, and may protect a top surface of thecapping layer. The aforementioned description of the functional layermay selectively apply to other exemplary embodiments described herein.

Descriptions of materials used to form the first electrode 311, thesecond electrode 312, and the intermediate layer 313 disposed betweenthe first electrode 311 and the second electrode 312 are the same asdescribed in the exemplary embodiments above, and, as such, detaileddescriptions thereof are omitted.

According to one or more exemplary embodiments, the through area TA mayhave a shape corresponding to the thickness of the substrate 301. Thatis, the through area TA may extend through the thickness of thesubstrate 301. Although not shown, in some exemplary embodiments, thethrough area TA may be formed to correspond to only a part of thethickness of the substrate 301. In this manner, a thickness of an areaof the substrate 301 corresponding to the through area TA may be smallerthan that of another area of the substrate 301.

The first display area DA1 may include the first encapsulation unit EU1formed on the first display unit DU1. The first encapsulation unit EU1may include a first encapsulation layer 351, a second encapsulationlayer 352, and an intermediate encapsulation layer 361. The firstencapsulation layer 351 may be formed on the first display unit DU1 andmay have an extending shape to correspond to the through area TA. Thatis, the first encapsulation layer 351 may be formed on the secondelectrode 312 of the first display unit DU1, and may be formed to atleast partially cover a side of the area of the first display unit DU1neighboring the through area TA. In some exemplary embodiments, thefirst encapsulation layer 351 may be formed to completely cover sides ofareas of the intermediate layer 313 and the second electrode 312 of thefirst display unit DU1 neighboring the through area TA.

The first encapsulation layer 351 may include any suitable insulatingmaterial. In some exemplary embodiments, the first encapsulation layer351 may include an inorganic material. In some exemplary embodiments,the first encapsulation layer 351 may include an oxide or nitridematerial. For instance, the first encapsulation layer 351 may includesilicon nitride (SiN_(x)), silicon oxide (SiO_(x)), or siliconoxynitride (SiO_(x)N_(y)). In some exemplary embodiments, the firstencapsulation layer 351 may include an organic material.

In some exemplary embodiments, the first encapsulation layer 351 mayextend to a top surface of the substrate 301. In some exemplaryembodiments, the first encapsulation layer 351 may be spaced apart froma side of the area of the substrate 301 corresponding to the througharea TA. In some exemplary embodiments, the first encapsulation layer351 may contact one of the insulating layers of the first lowerstructure LU1. That is, as shown in FIG. 7, the first encapsulationlayer 351 may contact the interlayer insulating layer 306 of the firstlower structure LU1. The first encapsulation layer 351 and theinterlayer insulating layer 306 may contact each other, therebyimproving an encapsulation characteristic of the first encapsulationunit EU1 with respect to the first display unit DU1. In this regard, aside of the interlayer insulating layer 306 facing the through area TAmay not be covered by the first encapsulation layer 351. In someexemplary embodiments, the first encapsulation layer 351 may contact thegate insulating layer 304 or the buffer layer 302. To this end, a sideof the gate insulating layer 304 or the buffer layer 302 facing towardthe through area TA may not be covered by the first encapsulation layer351.

According to one or more exemplary embodiments, as shown in FIG. 7, theinterlayer insulating layer 306, the gate insulating layer 304, and thebuffer layer 302 may be closer to the through area TA than the firstencapsulation layer 351. That is, edges of the interlayer insulatinglayer 306, the gate insulating layer 304, and the buffer layer 302 mayextend closer to the through area TA than an edge of the firstencapsulation layer 351 in an area corresponding to the through area TA.The edges of the interlayer insulating layer 306, the gate insulatinglayer 304, and the buffer layer 302 are illustrated in FIG. 7. That is,the interlayer insulating layer 306, the gate insulating layer 304, andthe buffer layer 302 may extend toward the through area TA, such thatthe interlayer insulating layer 306, the gate insulating layer 304, andthe buffer layer 302 may be at least closer to the through area TA thanthe first display unit DU1. However, exemplary embodiments are notlimited thereto. One of the interlayer insulating layer 306, the gateinsulating layer 304, and the buffer layer 302 may extend toward thethrough area TA, such that one of the interlayer insulating layer 306,the gate insulating layer 304, and the buffer layer 302 may be closer tothe through area TA than the first display unit DU1.

Another insulating layer of the first lower structure LU1, for example,the passivation layer 309 or the pixel-defining layer 315, may extendtoward the through area TA, such that the other insulating layer may becloser to the through area TA than the first display unit DU1. Theintermediate encapsulation layer 361 may at least overlap the firstdisplay unit DU1 and may be formed on the first encapsulation layer 351.In some exemplary embodiments, a top surface of the intermediateencapsulation layer 361 may include a planar surface. In some exemplaryembodiments, an edge of the area of the intermediate encapsulation layer361 neighboring the through area TA may not be disposed over an edge ofthe first encapsulation layer 351 neighboring the through area TA.

According to one or more exemplary embodiments, the intermediateencapsulation layer 361 may include any suitable material. Theintermediate encapsulation layer 361 may include an organic material.When the intermediate encapsulation layer 361 includes an organicmaterial, the top surface of the intermediate encapsulation layer 361may be easily formed as a planar surface. In some exemplary embodiments,the intermediate encapsulation layer 361 may include an inorganicmaterial.

The second encapsulation layer 352 may be formed on the intermediateencapsulation layer 361 and the first display unit DU1. To this end, thesecond encapsulation layer 352 may have an extending shape to correspondto the through area TA. That is, the second encapsulation layer 352 maybe formed to at least partially cover the side of the area of the firstdisplay unit DU1 neighboring the through area TA. In some exemplaryembodiments, the second encapsulation layer 352 may be formed tocompletely cover the sides of the areas of the intermediate layer 313and the second electrode 312 of the first display unit DU1 neighboringthe through area TA. In some exemplary embodiments, the secondencapsulation layer 352 may contact the first encapsulation layer 351 inan area toward at least the through area TA.

In some exemplary embodiments, the second encapsulation layer 352 maycover the first encapsulation layer 351, and the first encapsulationlayer 351 may not be exposed by the second encapsulation layer 352 inthe through area TA. In some exemplary embodiments, the secondencapsulation layer 352 may include any suitable insulating material. Insome exemplary embodiments, the second encapsulation layer 352 mayinclude an inorganic material. In some exemplary embodiments, the secondencapsulation layer 352 may include an oxide or nitride material. Forinstance, the second encapsulation layer 352 may include silicon nitride(SiN_(x)), silicon oxide (SiO_(x)), or silicon oxynitride(SiO_(x)N_(y)). In some exemplary embodiments, the second encapsulationlayer 352 may include an organic material.

In some exemplary embodiments, at least one of the first encapsulationlayer 351, the second encapsulation layer 352, and the intermediateencapsulation layer 361 may include a metal material. In some exemplaryembodiments, the second encapsulation layer 352 may extend to the topsurface of the substrate 301. In some exemplary embodiments, the secondencapsulation layer 352 may be spaced apart from the side of the area ofthe substrate 301 corresponding to the through area TA. In someexemplary embodiments, the second encapsulation layer 352 may contactone of the insulating layers of the first lower structure LU1. That is,as shown in FIG. 7, the second encapsulation layer 352 may contact theinterlayer insulating layer 306 of the first lower structure LU1.

The second encapsulation layer 352 and the interlayer insulating layer306 may contact each other, thereby improving an encapsulationcharacteristic of the first encapsulation unit EU1 with respect to thefirst display unit DU1. In this manner, a side of the interlayerinsulating layer 306 facing the through area TA may not be covered bythe second encapsulation layer 352. In some exemplary embodiments, thesecond encapsulation layer 352 may contact the gate insulating layer 304or the buffer layer 302. In this manner, a side of the gate insulatinglayer 304 or the buffer layer 302 facing the through area TA may not becovered by the second encapsulation layer 352.

In some exemplary embodiments, the interlayer insulating layer 306, thegate insulating layer 304, and the buffer layer 302 may be closer to thethrough area TA than the second encapsulation layer 352. That is, edgesof the interlayer insulating layer 306, the gate insulating layer 304,and the buffer layer 302 may extend more towards the through area TAthan an edge of the second encapsulation layer 352 in an areacorresponding to the through area TA. It is contemplated, however, thatexemplary embodiments are not limited thereto. The edges of theinterlayer insulating layer 306, the gate insulating layer 304, and thebuffer layer 302 may extend more towards the through area TA than or thesame as the edge of the second encapsulation layer 352 in the areacorresponding to the through area TA.

The edges of the interlayer insulating layer 306, the gate insulatinglayer 304, and the buffer layer 302 are illustrated in FIG. 7. That is,the interlayer insulating layer 306, the gate insulating layer 304, andthe buffer layer 302 may extend toward the through area TA, such thatthe interlayer insulating layer 306, the gate insulating layer 304, andthe buffer layer 302 may be at least closer to the through area TA thanthe first display unit DU1. However, exemplary embodiments are notlimited thereto. One of the interlayer insulating layer 306, the gateinsulating layer 304, and the buffer layer 302 may extend toward thethrough area TA, such that one of the interlayer insulating layer 306,the gate insulating layer 304, and the buffer layer 302 may be closer tothe through area TA than the first display unit DU1.

Another insulating layer of the first lower structure LU1, for example,the passivation layer 309 or the pixel-defining layer 315, may extendtoward the through area TA, such that the other insulating layer may becloser to the through area TA than the first display unit DU1. In someexemplary embodiments, the second encapsulation layer 352 may includethe same material as that of the first encapsulation layer 351, and, assuch, the first encapsulation layer 351 and the second encapsulationlayer 352 may easily contact each other in the area neighboring thethrough area TA. In this manner, the first encapsulation layer 351 andthe second encapsulation layer 352 may easily reduce or block moisture,impurities, external air, debris, etc. from the first display unit DU1in the through area TA. In some exemplary embodiments, the intermediateencapsulation layer 361 may be surrounded by the first encapsulationlayer 351 and the second encapsulation layer 352.

The second display area DA2 may include the second encapsulation unitEU2 formed on the second display unit. The second encapsulation unit EU2may include a first encapsulation layer 371, a second encapsulationlayer 372, and an intermediate encapsulation layer 381. The firstencapsulation layer 371 may be formed on the second display unit DU2 andmay have an extending shape to correspond to the through area TA. Thatis, the first encapsulation layer 371 may be formed on the secondelectrode 312 of the second display unit DU2 and may be formed to atleast partially cover a side of the area of the second display unit DU2neighboring the through area TA. In some exemplary embodiments, thefirst encapsulation layer 371 may be formed to completely cover sides ofareas of the intermediate layer 313 and the second electrode 312 of thesecond display unit DU2 neighboring the through area TA.

In some exemplary embodiments, the first encapsulation layer 371 mayinclude any suitable insulating material. In some exemplary embodiments,the first encapsulation layer 371 may include an inorganic material. Insome exemplary embodiments, the first encapsulation layer 371 mayinclude an oxide or nitride material. For example, the firstencapsulation layer 371 may include silicon nitride (SiN_(x)), siliconoxide (SiO_(x)), or silicon oxynitride (SiO_(x)N_(y)). In some exemplaryembodiments, the first encapsulation layer 371 may include an organicmaterial.

According to one or more exemplary embodiments, the first encapsulationlayer 371 may extend to the top surface of the substrate 301. In someexemplary embodiments, the first encapsulation layer 371 may be spacedapart from the side of the area of the substrate 301 corresponding tothe through area TA. Although not provided, a description of the firstencapsulation layer 351 of the first display area DA1 provided withreference to FIG. 7, i.e., a description in connection with the firstlower structure LU1, may apply to that of the first encapsulation layer371 of the second display area DA2, and, as such, a detailed descriptionthereof is omitted.

The intermediate encapsulation layer 381 may at least overlap with thesecond display unit DU2 and may be formed on the first encapsulationlayer 371. In some exemplary embodiments, a top surface of theintermediate encapsulation layer 381 may include a planar surface. Insome exemplary embodiments, an edge of the area of the intermediateencapsulation layer 381 neighboring the through area TA may not be overan edge of the first encapsulation layer 371 neighboring the througharea TA. In some exemplary embodiments, the intermediate encapsulationlayer 381 may include any suitable material. The intermediateencapsulation layer 381 may include an organic material. When theintermediate encapsulation layer 381 includes an organic material, thetop surface of the intermediate encapsulation layer 381 may be easilyformed as a planar surface. In some exemplary embodiments, theintermediate encapsulation layer 381 may include an inorganic material.

The second encapsulation layer 372 may be formed on the intermediateencapsulation layer 381 and the second display unit DU2. The secondencapsulation layer 372 may have an extending shape to correspond to thethrough area TA. That is, the second encapsulation layer 372 may beformed to at least partially cover the side of the area of the seconddisplay unit DU2 neighboring the through area TA. In some exemplaryembodiments, the second encapsulation layer 372 may be formed tocompletely cover the sides of the areas of the intermediate layer 313and the second electrode 312 of the second display unit DU2 neighboringthe through area TA. In some exemplary embodiments, the secondencapsulation layer 372 may contact the first encapsulation layer 371 inan area facing toward at least the through area TA. In some exemplaryembodiments, the second encapsulation layer 372 may cover the firstencapsulation layer 371, and the first encapsulation layer 371 may notbe exposed by the second encapsulation layer 372 in the through area TA.

In some exemplary embodiments, the second encapsulation layer 372 mayinclude any suitable insulating material. In some exemplary embodiments,the second encapsulation layer 372 may include an inorganic material. Insome exemplary embodiments, the second encapsulation layer 372 mayinclude an oxide or nitride material. For example, the secondencapsulation layer 372 may include silicon nitride (SiN_(x)), siliconoxide (SiO_(x)), or silicon oxynitride (SiO_(x)N_(y)). In some exemplaryembodiments, the second encapsulation layer 372 may include an organicmaterial.

In some exemplary embodiments, at least one of the first encapsulationlayer 371, the second encapsulation layer 372, and the intermediateencapsulation layer 381 may include a metal material. In some exemplaryembodiments, the second encapsulation layer 372 may extend to the topsurface of the substrate 301. In some exemplary embodiments, the secondencapsulation layer 372 may be spaced apart from the side of the area ofthe substrate 301 corresponding to the through area TA. Although notprovided in association with the second encapsulation layer 372, adescription of the second encapsulation layer 352 of the first displayarea DA1 provided with reference to FIG. 7, i.e., a description inconnection with the first lower structure LU1, may apply to that of thesecond encapsulation layer 372 of the second display area DA2, and, assuch, a detailed description thereof is omitted.

In some exemplary embodiments, the second encapsulation layer 372 mayinclude the same material as that of the first encapsulation layer 371,and, as such, the first encapsulation layer 371 and the secondencapsulation layer 372 may easily contact one another in the areaneighboring the through area TA. This may easily reduce or blockmoisture, impurities, external air, debris, etc., from the seconddisplay unit DU2 in the through area TA. In some exemplary embodiments,the intermediate encapsulation layer 381 may be surrounded by the firstencapsulation layer 371 and the second encapsulation layer 372.

As described above, the first encapsulation unit EU1 and the secondencapsulation unit EU2 may include the same material as one another andmay be simultaneously formed. That is, the first encapsulation layer 351of the first display area DA1 and the first encapsulation layer 371 ofthe second display area DA2 may include the same material and may beselectively simultaneously formed. The second encapsulation layer 352 ofthe first display area DA1 and the second encapsulation layer 372 of thesecond display area DA2 may include the same material and may beselectively simultaneously formed. The intermediate encapsulation layer361 of the first display area DA1 and the intermediate encapsulationlayer 381 of the second display area DA2 may include the same materialand may be selectively simultaneously formed.

According to one or more exemplary embodiments, the display apparatus300 may include the first display area DA1 and the second display areaDA2 and the through area TA disposed between the first display area DA1and the second display area DA2. The display apparatus 300 may becapable of adding various functions via the through area TA. That is,the through area TA may be a space for a separate member (or component)for a function of the display apparatus 300 or a separate member foradding a new function to the display apparatus 300. This may improveuser convenience.

According to one or more exemplary embodiments, the first display areaDA1 may include the first display unit DU1 and the first encapsulationunit EU1, and the first encapsulation layer 351 or the secondencapsulation layer 352 of the first encapsulation unit EU1 may extendto cover one area of the side of at least the first display unit DU1corresponding to the through area TA. This may effectively protect thefirst display unit DU1, and, in particular, protect the first displayunit DU1 from external shock, impurities, air, moisture, debris, etc.,in the area of the first display unit DU1 corresponding to the througharea TA. When the first encapsulation layer 351 or the secondencapsulation layer 352 covers the whole area of the side of the firstdisplay area DA1 corresponding to the through area TA, an effect ofprotecting the first display unit DU1 may increase.

The intermediate encapsulation layer 361 may be formed between the firstencapsulation layer 351 and the second encapsulation layer 352, therebyimproving an encapsulation characteristic of the first encapsulationunit EU1 with respect to the first display unit DU1. When a top surfaceof the intermediate encapsulation layer 361 is selectively formed as aplanar surface, the second encapsulation layer 352 may be planar, and atop surface of the display apparatus 300 may be easily formed as planartoo.

The second display area DA2 may include the second display unit DU2 andthe second encapsulation unit EU2, and the first encapsulation layer 371or the second encapsulation layer 372 of the second encapsulation unitEU2 may extend to cover one area of the side of at least the seconddisplay unit DU2 corresponding to the through area TA. This mayeffectively protect the second display unit DU2, and, in particular,protect the second display unit DU2 from external shock, impurities,air, moisture, debris, etc., in the area of the second display unit DU2corresponding to the through area TA. When the first encapsulation layer371 or the second encapsulation layer 372 selectively covers the wholearea of the side of the second display area DA2 corresponding to thethrough area TA, an effect of protecting the second display unit DU2 mayincrease.

The intermediate encapsulation layer 381 may be formed between the firstencapsulation layer 371 and the second encapsulation layer 372, whichmay improve an encapsulation characteristic of the second encapsulationunit EU2 with respect to the second display unit DU2. When a top surfaceof the intermediate encapsulation layer 381 is selectively formed with aplanar surface, the second encapsulation layer 372 may be planar, andthe top surface of the display apparatus 300 may be easily formed asplanar too.

FIG. 8 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments. When the displayapparatus 400 of FIG. 8 is compared to the display apparatus 300 of FIG.7, a first protection pattern MS1 and a second protection pattern MS2are added to the display apparatus 400. For descriptive convenience, thedifferences between FIGS. 7 and 8 will be described below andsimilarities will be generally omitted to avoid obscuring exemplaryembodiments described herein.

Referring to FIG. 8, the display apparatus 400 may include the firstdisplay area DA1, the second display area DA2, and the through area TA.The through area TA may be disposed between the first display area DA1and the second display area DA2. The first display area DA1 of thedisplay apparatus 400 may include the first lower structure LU1, and thesecond display area DA2 may include the second lower structure LU2.

The part DU1′ of a first display unit DU1 may be formed on the firstlower structure LU1. For example, the part DU1′ of the first displayunit DU1 may include at least an intermediate layer 413 and a secondelectrode 412 of the first display unit DU1. A description of the firstlower structure LU1 is the same as described in association with thedisplay apparatus 300, and, as such, a detailed description thereof isomitted. The part DU2′ of a second display unit may DU2 be formed on thesecond lower structure LU2. For example, the part DU2′ of the seconddisplay unit DU2 may include at least the intermediate layer 413 and thesecond electrode 412 of the second display unit DU2. A description ofthe second lower structure LU2 is the same as described in associationwith the display apparatus 300, and, as such, a detailed descriptionthereof is omitted.

The first protection pattern MS1 may be formed on the intermediate layer413 and may correspond to a side of an area of the second electrode 412facing toward the through area TA. In some exemplary embodiments, thefirst protection pattern MS1 may be formed between the second electrode412 and the first encapsulation unit EU1. For example, the firstprotection pattern MS1 may be formed between the second electrode 412and a first encapsulation layer 451 of the first encapsulation unit EU1,and, as such, a side of the second electrode 412 may be spaced apartfrom the first encapsulation unit EU1, thereby effectively protectingthe side of the second electrode 412. The first protection pattern MS1may include any suitable material. In some exemplary embodiments, thefirst protection pattern MS1 may include a material that does not mixwith a material forming the second electrode 412, for example, anorganic material. In some exemplary embodiments, the first protectionpattern MS1 may include a part of a material forming the intermediatelayer 413. For example, the first protection pattern MS1 may include amaterial of an emission layer forming the intermediate layer 413. Asanother example, the first protection pattern MS1 may include a hostmaterial of the emission layer.

The second protection pattern MS2 may be formed on the intermediatelayer 413 and may correspond to the side of the area of the secondelectrode 412 facing toward the through area TA. In some exemplaryembodiments, the second protection pattern MS2 may be formed between thesecond electrode 412 and the second encapsulation unit EU2. For example,the second protection pattern MS2 may be formed between the secondelectrode 412 and a first encapsulation layer 471 of the secondencapsulation unit EU2, and, as such, a side of the second electrode 412may be spaced apart from the second encapsulation unit EU2, therebyeffectively protecting the side of the second electrode 412. The secondprotection pattern MS2 may include any suitable material. In someexemplary embodiments, the second protection pattern MS2 may include amaterial that does not mix with the material forming the secondelectrode 412, for example, an organic material. In some exemplaryembodiments, the second protection pattern MS2 may include a part of amaterial forming the intermediate layer 413. For example, the secondprotection pattern MS2 may include the material of the emission layerforming the intermediate layer 413. As another example, the secondprotection pattern MS2 may include the host material of the emissionlayer.

Descriptions of other elements of the display apparatus 400 are the sameas described in association with the display apparatus 300, and, assuch, detailed descriptions are omitted. According to one or moreexemplary embodiments, in the display apparatus 400, the firstprotection pattern MS1 and the second protection pattern MS2 may beformed on the intermediate layer 413 and may correspond to the side ofthe area of the second electrode 412 facing toward the through area TA.That is, in an operation before the display apparatus 400 is finallymanufactured, permeation of moisture through the side of the secondelectrode 412 may be effectively blocked or reduced via the firstprotection pattern MS1 and the second protection pattern MS2.

The first protection pattern MS1 and the second protection pattern MS2are spaced apart from each other in FIG. 8. However, when the firstdisplay area DA1 and the second display area DA2 are connected to eachother as shown in FIG. 2C, the first protection pattern MS1 and thesecond protection pattern MS2 may be connected to each other, and, insome exemplary embodiments, may surround the through area TA.

FIG. 9 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

Referring to FIG. 9, the display apparatus 500 may include the firstdisplay area DA1, the second display area DA2, and the through area TA.The through area TA may be disposed between the first display area DA1and the second display area DA2. In some exemplary embodiments, thedisplay apparatus 500 may include the substrate 101. That is, thedisplay apparatus 500 of FIG. 9 is the same as the display apparatus 100of FIG. 1, except for an insertion unit IU. As such, detaileddescriptions of elements other than the insertion unit IU are omitted toavoid obscuring exemplary embodiments described herein. Although notshown, the display apparatus 500 of FIG. 9 may apply to the displayapparatuses 200, 300, and 400 described above. Not only the displayapparatus 500 of FIG. 9, but also the display apparatuses 200, 300, and400 may apply to display apparatuses 600 and 700 of FIGS. 10 through 12that will be described in more detail below.

The display apparatus 500 may include the insertion unit IU. Theinsertion unit IU may include an insertion member IU1 and a connectionmember IU2. The insertion member IU1 may be disposed in correspondencewith the through area TA. Although the insertion member IU1 tightlycontacts the substrate 101 and the encapsulation units EU1 and EU2 inFIG. 9, exemplary embodiments are not limited thereto. For instance, andthe insertion member IU1 may be spaced apart from the substrate 101 andthe encapsulation units EU1 and EU2.

The insertion member IU1 may perform at least one of various functionsand may transfer driving force or electric force to the connectionmember IU2 that will be described in more detail below. The insertionmember IU1 may support the connection member IU2. In some exemplaryembodiments, the insertion member IU1 may be disposed in the through areTA and may perform a simple non-display area function.

The connection member IU2 may be a driving member or a display memberthat generates light, and may perform other various functions. Theconnection member IU2 may overlap the through area TA or may be disposedoutside the through area TA. In some exemplary embodiments, theconnection member IU2 may be spaced apart from the first display areaDA1 and the second display area DA2.

FIG. 10 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments.

Referring to FIG. 10, the display apparatus 600 may include a firstmotion member MM1 and a second motion member MM2 in addition to theother elements of the display apparatus 500 of FIG. 9. For descriptiveconvenience, the differences between FIGS. 9 and 10 will now bedescribed below.

The first motion member MM1 and the second motion member MM2 may beconnected to the connection member IU2. The first motion member MM1 andthe second motion member MM2 may be moved by the connection member IU2.The first motion member MM1 and the second motion member MM2 mayindependently move, and, in some exemplary embodiments, may integrallymove. In some exemplary embodiments, the first motion member MM1 and thesecond motion member MM2 may be moved by the insertion member IU1. Insome exemplary embodiments, the first motion member MM1 and the secondmotion member MM2 may be one of a second hand, a minute hand, and anhour hand of a clock. In this manner, information regarding a timedisplay may be displayed on the first display area DA1 and the seconddisplay area DA2. The first motion member MM1 and the second motionmember MM2 may be spaced apart from the first display area DA1 and thesecond display area DA2.

FIG. 11 is a schematic cross-sectional view of a display apparatus,according to one or more exemplary embodiments. FIG. 12 is a partialplan view of the display apparatus of FIG. 11 as viewed in a directionK, according to one or more exemplary embodiments.

Referring to FIGS. 11 and 12, the display apparatus 700 may furtherinclude a base member BU in addition to the components described inassociation with the display apparatus 600 of FIG. 10. For descriptiveconvenience, the differences between FIGS. 10 and 11 will be describedbelow.

The base member BU may be disposed in a lower portion of the insertionmember IU1. That is, the base member BU may be disposed in a lowerportion of the substrate 101. The base member BU may support theinsertion member IU1. The base member BU may be disposed in the lowerportion of the substrate 101 to support the substrate 101, therebyimproving the durability of the display apparatus 700. In some exemplaryembodiments, the base member BU may send a different function (orsignal), for example, an electrical signal or power, to the insertionmember IU1.

The first motion member MM1 and the second motion member MM2 may beconnected to and may be moved by the connection member IU2. The firstmotion member MM1 and the second motion member MM2 may independentlymove, and, in some exemplary embodiments, may integrally move. In someexemplary embodiments, the first motion member MM1 and the second motionmember MM2 may be moved by the insertion member IU1 or the base memberBU. In some exemplary embodiments, the first motion member MM1 and thesecond motion member MM2 may be one of a second hand, a minute hand, andan hour hand of a clock. In this manner, information regarding a timedisplay may be displayed on the first display area DA1 and the seconddisplay area DA2.

FIGS. 13A through 13F are cross-sectional views of a display apparatusat various stages of manufacture, according to one or more exemplaryembodiments. To this end, a method of manufacturing the displayapparatus 300 of FIG. 5 will be described in association with FIGS. 13Athrough 13F. The method of manufacturing the display apparatus 300 isdescribed as an example. Further, descriptions of the materials used toform various components, members, etc., have been omitted to avoidobscuring exemplary embodiments described herein. Also, the descriptionin association with FIGS. 13 through 13F may apply to the displayapparatuses 100, 200, 500, 600, and 700.

Referring to FIG. 13A, a preliminary lower structure LU′ for forming alower structure that will be described below, a preliminary intermediatelayer 313′ for forming an intermediate layer that will be describedbelow, and a preliminary second electrode 312′ for forming a secondelectrode that will be described below may be formed on the substrate301.

A preliminary through area TA′ may be formed as shown in FIG. 13B byperforming one or more etching processes using an etching source LD,such that the preliminary through area TA′ may correspond to an areathat will overlap with a through area that will be described below. Theetching source LD may have various types, and, include, for example, alaser beam. Referring to FIG. 13B, since the preliminary through areaTA′ is formed, a preliminary first display area DA1′ and a preliminarysecond display area DA2′ may be formed having the preliminary througharea TA′ disposed between the preliminary first display area DA1′ andthe preliminary second display area DA2′. The preliminary through areaTA′ may not be formed in a thickness direction of at least the substrate301 or the preliminary lower structure LU′. That is, the preliminarythrough area TA may not extend into the preliminary lower structure LU′and the substrate 301. In some exemplary embodiments, the preliminarythrough area TA′ may be formed in a thickness direction of the substrate301 and the preliminary lower structure LU′. Each of the preliminaryfirst display area DA1′ and the preliminary second display area DA2′ mayinclude the intermediate layer 313 and the second electrode 312.

Referring to FIG. 13C, a preliminary first encapsulation layer 351′ forforming a first encapsulation layer may be formed. The preliminary firstencapsulation layer 351′ may be formed on the preliminary first displayarea DA1′, the preliminary second display area DA2′, and the preliminarythrough area TA′.

Referring to FIG. 13D, the intermediate encapsulation layer 361 and theintermediate encapsulation layer 381 may be formed on the preliminaryfirst encapsulation layer 351′, such that the intermediate encapsulationlayer 361 and the intermediate encapsulation layer 381 may respectivelycorrespond to the preliminary first display area DA1′ and thepreliminary second display area DA2′. The intermediate encapsulationlayer 361 and the intermediate encapsulation layer 381 may have apattern and may be patterned by using various methods. For example, theintermediate encapsulation layer 361 and the intermediate encapsulationlayer 381 may be formed via a printing technology.

Referring to FIG. 13E, a preliminary second encapsulation layer 352′ forforming a second encapsulation layer may be formed. The preliminarysecond encapsulation layer 352′ may be formed to correspond to thepreliminary first display area DA1′, the preliminary second display areaDA2′, and the preliminary through area TA′, and, in some exemplaryembodiments, may cover the intermediate encapsulation layer 361 and theintermediate layer 381. The preliminary second encapsulation layer 352′may contact the preliminary first encapsulation layer 351′ in an areacorresponding to the preliminary through area TA′.

According to one or more exemplary embodiments, a cutting line CL may bedisposed in the preliminary through area TA′ and a cutting operation maybe performed in relation to the cutting line CL. In this manner, thesubstrate 301, the preliminary lower structure LU′, the preliminaryfirst encapsulation layer 351′, and the preliminary second encapsulationlayer 352′ that correspond to the preliminary through area TA′ may beremoved in association with the cutting operation. The cutting operationmay be performed by using various methods, for example, using a laserbeam.

Accordingly, the display apparatus 300 may be manufactured as shown inFIG. 13F. In this manner, the manufacturing method may easily form thedisplay apparatus 300 including the first display area DA1 and thesecond display area DA2 with the through area TA disposed between thefirst display area DA1 and the second display area DA2. That is, thethrough area TA may be easily formed and the formation process mayreduce damage to the first display unit DU1 and the second display unitDU2. Although not shown, a protection film may be further formed on thelower portion of the substrate 301, and the through area TA may beremoved in the cutting operation. Such a protection film may apply toexemplary embodiments that will be described below in association withFIGS. 14A through 14H.

FIGS. 14A through 14H are cross-sectional views of a display apparatusat various stages of manufacture, according to one or more exemplaryembodiments. To this end, a method of manufacturing the displayapparatus 400 of FIG. 8 will be described in association with FIGS. 14Athrough 14H. The method of manufacturing the display apparatus 400 isdescribed as an example. Further, descriptions of materials used to formmembers, components, etc., have been omitted to avoid obscuringexemplary embodiments described herein. Also, the description inassociation with FIGS. 14A through 14H may apply to the formation ofdisplay apparatuses 100, 200, 500, 600, and 700.

Referring to FIG. 14A, the preliminary lower structure LU′ for forming alower structure that will be described below, and a preliminaryintermediate layer 413′ for forming an intermediate layer that will bedescribed below may be formed on the substrate 301.

Referring to FIG. 14B, a preliminary protection pattern MS' for forminga protection pattern may be formed on the preliminary intermediate layer413′. The preliminary protection pattern MS' may be formed to correspondto an area that will overlap a through area that will be describedbelow.

Referring to FIG. 14C, a second electrode 412 may be formed on thepreliminary intermediate layer 413′. The second electrode 412 may beformed adjacent to the preliminary protection pattern MS′, and, in someexemplary embodiments, may be formed adjacent to a side of thepreliminary protection pattern MS′. In this manner, in some exemplaryembodiments, when the preliminary protection pattern MS' includes amaterial that does not mix with the second electrode 412, the secondelectrode 412 may be patterned by the preliminary protection pattern MS'without a separate patterning operation. That is, the second electrode412 may not mix with the preliminary protection pattern MS′, may beformed in the side of the preliminary protection pattern MS′, and, insome exemplary embodiments, may be spaced apart from at least one areaof a top surface of the preliminary protection pattern MS′.

The preliminary through area TA′ may be formed as shown in FIG. 14D byperforming an etching process using the etching source LD, such that thepreliminary through area TA′ may correspond to the area that willoverlap with the through area that will be described below. The etchingsource LD may have various types, and, include, for example, a laserbeam. Referring to FIG. 14D, since the preliminary through area TA′ isformed, the preliminary first display area DA1′ and the preliminarysecond display area DA2′ may be formed having the preliminary througharea TA′ disposed between the preliminary first display area DA1′ andthe preliminary second display area DA2′. The preliminary through areaTA′ may not be formed in a thickness direction of at least a substrate401 or the preliminary lower structure LU′. In some exemplaryembodiments, the preliminary through area TA′ may be formed in athickness direction of the substrate 401 and the preliminary lowerstructure LU′.

According to one or more exemplary embodiments, each of the preliminaryfirst display area DA1′ and the preliminary second display area DA2′ mayinclude the intermediate layer 413 and the second electrode 412. Whenthe preliminary through area TA′ is formed, one area of the preliminaryprotection pattern MS' may be removed so that the first protectionpattern MS1 and the second protection pattern MS2 may be formed. In someexemplary embodiments, when the preliminary through area TA′ is formed,the preliminary protection pattern MS' may be wholly removed, and, assuch, the first protection pattern MS1 and the second protection patternMS2 may not be formed.

Referring to FIG. 14E, a preliminary first encapsulation layer 451′ forforming a first encapsulation layer may be formed. The preliminary firstencapsulation layer 451′ may be formed on the preliminary first displayarea DA1′, the preliminary second display area DA2′, and the preliminarythrough area TA′.

Referring to FIG. 14F, an intermediate encapsulation layer 461 and anintermediate encapsulation layer 481 may be formed on the preliminaryfirst encapsulation layer 451′, such that the intermediate encapsulationlayer 461 and the intermediate encapsulation layer 481 may respectivelycorrespond to the preliminary first display area DA1′ and thepreliminary second display area DA2′. The intermediate encapsulationlayer 461 and the intermediate encapsulation layer 481 may have apattern and may be patterned by using various methods. For example, theintermediate encapsulation layer 461 and the intermediate encapsulationlayer 481 may be formed via a printing technology.

Referring to FIG. 14G, a preliminary second encapsulation layer 452′ forforming a second encapsulation layer may be formed. The preliminarysecond encapsulation layer 452′ may be formed to correspond to thepreliminary first display area DA1′, the preliminary second display areaDA2′, and the preliminary through area TA′, and, in some exemplaryembodiments, may cover the intermediate encapsulation layer 461 and theintermediate encapsulation layer 481. The preliminary secondencapsulation layer 452′ may contact the preliminary first encapsulationlayer 451′ in an area corresponding to the preliminary through area TA′.

A cutting line CL may be disposed in the preliminary through area TA′and a cutting operation may be performed in relation to the cutting lineCL, and, as such, the substrate 401, the preliminary lower structureLU′, the preliminary first encapsulation layer 451′, and the preliminarysecond encapsulation layer 452′ that correspond to the preliminarythrough area TA′ may be removed. The cutting operation may be performedby using various methods, for example, a laser beam.

Accordingly, the display apparatus 400 may be manufactured as shown inFIG. 14H. In this manner, the manufacturing method may easily form thedisplay apparatus 400 including the first display area DA1 and thesecond display area DA2 with the through area TA disposed between thefirst display area DA1 and the second display area DA2. That is, thethrough area TA may be easily formed and the formation process mayreduce damage of the first display unit DU1 and the second display unitDU2. In this manner, after the preliminary protection pattern MS' isformed, the second electrode 412 may be formed, thereby facilitatingpatterning of the second electrode 412. The first protection pattern MS1and the second protection pattern MS2 may effectively protect a side ofan area of the second electrode 412 facing toward the through area TA.

According to one or more exemplary embodiments, a display apparatushaving an improved durability and an improved characteristic of imagequality, and a method of manufacturing the display apparatus have beendescribed. In this manner, an insertion unit (such as a clock mechanism)may be formed in the through area to add a function to the displayapparatus. It is contemplated, however, that the insertion unit maycorrespond to any suitable mechanism to add a function to the displayapparatus.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. A display apparatus comprising: a substrate; afirst display area disposed on the substrate, the first display areacomprising a first display unit configured to generate light and a firstencapsulation unit disposed on the first display unit; a second displayarea disposed on the substrate, the second display area comprising asecond display unit configured to generate light and a secondencapsulation unit disposed on the second display unit; and a separationregion comprising a space between the first display area and the seconddisplay area so as to distinguish the first display area from the seconddisplay area in at least one region, wherein: at least a portion of thefirst encapsulation unit covers at least one region of the separationregion; at least a portion of the second encapsulation unit covers atleast one region of the separation region; and the first encapsulationunit and the second encapsulation unit comprise a same material, whereinthe first display area further comprises a first lower structure,wherein the first lower structure comprises: an insulating layerdisposed on the substrate; and a thin film transistor disposed on thesubstrate, the thin film transistor being electrically connected to thefirst display unit and comprising an electrode; and wherein, in adirection normal to a surface of the substrate, the insulating layer isdisposed between the electrode and the substrate.